MEMS SENSOR TECHNOLOGY
Consensic's leading technology in capacitive Micro-electromechanical systems (MEMS) sensors bridge the gap for low cost, low power, high performance, and simple to integrate solutions.
Capacitive vs. Piezoresistive
MEMS-based sensors for pressure consist mainly of two transduction methods, piezoresistive and capacitive.
In piezoresistive pressure sensors, implanted piezoresistors are formed at critical stress points of the diaphragm deflection. The applied pressure to the diaphragm causes a strain and a change in resistance is measured.
Consensic's absolute capacitive pressure sensor comprises of a hermetic silicon to silicon fused top and bottom electrode with an internal vacuum cavity. Our proprietary TSV (Through Silicon Via) technology enables the charge transduction from the top of one electrode to the bulk of the silicon. This TSV enabling technology sets Consensic apart from traditional sensors, allowing the delivery of robust and highly reliable sensors to any application.